Thermal insulation panel Klipla®P

THERMAL INSULATION PANEL KLIPLA® P

High density.
High dimensions stability.
High thermal insulation.
High mechanical strength.

Aproved by national technical approvals Z-33.46-928 - aproved by German institute for engineering DIBt. Meet the requirements of EN 13163 INSULATION PANEL KLIPLA® P

Application

The KLIPLA®P thermal insulation panels are designed for carrying out the thermal insulation of outer walls in the KLIPLA®system. The full system consists of KLIPLA®K adhesive mortar,KLIPLA®F pointing mortar, KLIPLA®D expansion anchors and KLIPLA® C brick slips. This set of products including KLIPLA®P panels has been granted a Technical Approval of the Building Research National technical approvals Z-33.46-928 - aproved by German institute for engineering DIBt.

Properties

The KLIPLA®P thermal insulation panels are manufactured with a method of automatic forming.

This innovative product features:

a large compactness and density of styrofoam granules,
a special hydrophobic outer layer (film) that protects the board against the penetration of water,
high shape stability –no material aging is needed,
good heat insulation properties high mechanical resistance.

The KLIPLA®P thermal insulation panels incorporate the following innovative features:

cascade-like side edges allow for panel overlapping, which facilitates fixing and eliminates any thermal bridging on the contact edges.
the grooved square system on the back panel surface enlarges the fixing surface to the wall.
the grooved system of oblique squares on the front surface enlarges the fixing surface for brick slips.
the properly shaped recesses for mechanical fasteners facilitate their installation.
the shaped horizontal guides are adjusted to the tile dimensions for easier tile fixing and to provide good facade aesthetics.

Code marking

In accordance with the EN 13163 standard the KLIPLA®P thermal insulation panels are marked with the following code:

EPS-EN 13163 – T2 – L2 – W2 – S2 – P4 – BS255 – CS(10)150 – DS(N)2 – DS(70)1 – TR200
EPS-EN 13163 – T2 – L2 – W2 – S2 – P4 – BS255 – CS(10)100 – DS(N)2 – DS(70)1 - TR200

Thermal insulation properties

The KLIPLA®P panels feature good thermal insulation properties. The thermal conductivity λ amounts to 0.034 W/m2K. The resultant thermal resistance amounts to the following values depending on the board thickness:

Board thickness [mm]	50	80	100	120	140	150	160	180
Thermal resistanceR[m2K/W]	1,45	2,35	2,90	3,50	4,10	4,40	4,70	5,25

Physical parameters

The KLIPLA®P thermal insulation panels have the following physical parameters:

Compressive stress at 10% relative strain	> 150 kPa
Bending strength	> 200 kPa
Tensile strength perpendicular to face surfaces	> 200 kPa
Water absorbability at long - term immersion	< 0,5%
Length tolerance	±2 mm
Width tolerance	±2 mm
Thickness tolerance	±1 mm

INSULATION PANEL KLIPLA® P

KLIPLA®P formaat NF 240 x 71 x 15/20 mm

KLIPLA®P formaat WF+DF 1215x596 mm

Packaging

Board thickness	Pieces in package	Coverage per package
50 mm	10	7,20 m²
80 mm	6	4,32 m²
100 mm	5	3,60 m²
120 mm	4	2,88 m²
140 mm	3	2,88 m²
150 mm	3	2,16 m²
160 mm	3	2,16 m²
180 mm	3	2,16 m²